PowerFirst’s Quality Driven ODM represents the new generation of intelligent manufacturing for the power electronics and new energy industry. We integrate deep expertise in charging technology, power conversion, energy storage, and high-precision PCBA assemblies, transforming complex designs into reliable, scalable, and globally certified products. From EV chargers and mobility power systems to battery management PCBA and industrial-grade power modules, PowerFirst delivers one-stop ODM solutions that balance
engineering excellence, lean manufacturing, and uncompromising quality.

High-Reliability PCBA Production — Advanced SMT lines, AOI inspection, ICT/FCT testing, and conformal coating ensure industrial-grade reliability.
Power Electronics Expertise — Decades of experience in AC/DC, DC/DC, and on-board charger design for mobility, storage, and robotics.
Intelligent Manufacturing System — MES + ERP + AI Quality Tracking for full-process data traceability.
Global Compliance & Certification — Products certified by UL, CE, CB, FCC, PSE, KC, and RoHS standards.
Thermal & EMC Engineering — Independent R&D labs for heat dissipation, EMI/EMC, and environmental testing.
Equipped with ASM printers, Panasonic placement machines, reflow ovens, and 3D AOI inspection systems, ensuring stable and reliable quality in component placement and soldering.
Equipped with selective wave soldering, AOI, ICT, and FCT, ensuring consistent and reliable through-hole soldering quality.
Includes dispensing machines, coating machines, and UV curing ovens, delivering high automation and stable operation to enhance product reliability and environmental resistance.
Equipped with automatic screw-driving systems, vision-based error-proofing systems, and full process data-traceability systems. Highly integrated automation minimizes manual intervention, prevents errors, and enhances overall production quality.
Through Quality Driven ODM, PowerFirst bridges the gap between innovation and massproduction- delivering high-performance, high-reliability, and globally compliant powersolutions that energize the future.

| Article | Description | Capability |
| Service | PCB and SMT assembly with one-stop service | |
| Material | Laminate materials | FR4, high TG FR4, high frequency, alum, FPC |
| Board cutting | Number of layers | 1-48 |
| Min. thickness for inner layers (Cu thickness are excluded) | 0.003” (0.07mm) | |
| Board thickness | Standard | 0.1-4mm±10% |
| Min. | Single/Double: 0.008±0.004” | |
| 4 layer: 0.01±0.008” | ||
| 8 layer: 0.01±0.008” | ||
| Bow and twist | no more than 7/1000 | |
| Copper weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z | |
| Drilling | Min size | 0.0078” (0.2mm) |
| Drill deviation | ±0.002” (0.05mm) | |
| PTH hole tolerance | ±0.002” (0.005mm) | |
| NPTH hole tolerance | ±0.002” (0.005mm) | |
| Solder mask | Color | Green, white, black, red, blue… |
| Min solder mask clearance | 0.003” (0.07mm) | |
| Thickness | (0.012*0.017mm) | |
| Silkscreen | Color | White, black, yellow, blue… |
| Min size | 0.006” (0.15mm) | |
| E-test | Function Test | 100% Functional test |
| PCBA Testing | X-ray, AOI Test, Functional test | |
| PCB assembly | One-stop service electronic manufacturer service | |
| Component sourcing | Yes | |
| Certificate | IATF16949, ISO13485, ISO9001 | |
| Delivery time | PCB | 3-8 days |
| PCBA | 10-20 days | |
| Tolerance of PCB | ±5% | |
| Max size of finish board | 700*460mm | |
| MOQ | NO MOQ (1pcs) | |
| Surface Finish | HASL, ENIG, immersion silver, immersion tin, OSP… | |
| PCB outline | Square, circle, irregular (with jigs) | |
| Package | QFN, BGA, SSOP, PLCC, LGA | |
| Sub-assembly | Plastic, metal, screen | |